The lifespan of a LED lighting depends greatly on the amount of heat level, by virtue making of advancement of the heat level is one the vital technologies. However there are complex issues when it comes to solving of problems related to heat generated by the cheap over the heat sink, and that of cooling the entire body. The issues should be addressed in a proper way to increase the performance and efficiency of the LED lighting.
For this case the power of the LED lamp is necessary to consider the heat problem and on the other hand the power LED is needed for cooling purpose. Power LED therefore means an operating current which is greater than 100mA. According to the United States ASSIST Union, there are two types of LED; 2.1V and 3.3V with 210mw and 330mw respectively. By considering the thermal problems of the LED lighting, we are able to increase its lifespan. This therefore calls for a device that is able to spread the heat experienced. In trying to handle this issue of thermal problem, certain parameters have been designed in order to reduce heat resistance and the temperature rise at the junction. This parameters include the thermal parameters and the heat dissipation parameters.
Thermal resistance is a way of controlling the temperature difference between two state points on an external device in order to produce a steady flow of power across it. As reported by China technologies, the best thermal resistors at the moment for LED power is 10W followed by 5W and lastly 3W in that order. These thermal resistors helps to increase the life reliability.
Junction temperatures is the temperature between the semiconductors found on the LED device. It is normally reflected when the device is able to withstand the temperature. Improving the heat resistance has created plans targeting the United States SSL. Introducing Chip and Phosphor resistors to the temperature junction will basically increase the reliability of a device. The resistors comes in two i.e. phosphor 150 and phosphor 130. These helps to reduce the requirements needed for heat dissipation.
We have various types of temperature rise. These include the shell-environmental temperature which refers to a device set of temperature (it allows the LED lighting to be measured in terms of hot spot) and the environment temperature difference (it is done on the luminaire level from a distance of 5m from the source of light). This is a direct measurement of temperature difference and the cooling degree between the LED devices. Experimentally, it has been found that if the ambient temperature of the device is 30 and the bulb is 60 then the temperature should remain the same. Raising too high the temperature of the devices will reduce the functionality of the light source therefore reducing it lifespan.
There are two technologies which came into existence due to the development of the LED lighting products. First, the single-tube flux is needed to be increased to a higher current density. This process causes the chip to generate a lot of heat which requires cooling to be done on the LED device. Second, this concerns the structure of the package, when the power of the light source is increasing then it requires more power on the LED chip which is mounted together. The types of structures include the COB structure and the modular lamps. These therefore produce more heat which require more effective devices for cooling and the necessity to handle the new matters which give rise to dissipation of much heat. If not considered very carefully it may greatly affect the performance of the LED lamps hence reducing its life. This therefore means that when a new structure is introduced a perfect set of package should be used together for effective performance to be attained. Considering this precaution will help to increase the functionality of the lamp.
Currently, in accordance to various types of lamps, research shows that the overall efficiency of lamps is only 50 percent. The reason for the low percentage in efficiency is because of lack of proper devices to reduce the amount of heat produced by the lamps. A lot of power is produced which in turn produce a lot of heat thus lowering the effectiveness of the lamp. These therefore means that more sophisticated technology on led performance should be put in place to handle this issue. Another cause affecting the performance of the lamp is the modular lighting and high current density. These will create points with higher concentration of heat and to avoid this requires proper dissipation of heat.
Consider the following suggestions for heat level improvement
- Embrace the new technologies and new structures by use of chips. At the temperature junction, the LED chips will resist the temperature hence less heat is dissipated.
- Consider using the new technology and new package of structures for devices. This comes with high thermal conductivity, high resistance of heat, phosphor blend, and has new material which comprises of an adhesive between the metal. To meet the above features you have to use a thermal resistance of 10/ W or less.
- Use a material with good thermal conductivity to reduce heat up. In this way the ventilation channels should be designed and spread as soon as possible so that the heat required for heat up should not exceed 30. Also consider the use of modular lighting as it helps in reducing the level of heat dissipated.
- Use heat pipes to drive away the excess heat dissipated. This means you should put into consideration the cost of designing it.
Furthermore, the design of LED lighting should be made using good thermal conductivity materials with good lighting requirements. This helps the LED lighting to be more efficient, improve the heat level, and have good appearance. Some reports shows that using nanomaterials coated radiator, can improve the thermal performance by 30 percent. In the design of LED lighting, good mechanical properties and tightness should be considered for better results. The required temperature for dust radiator should be relatively small and should be around 30 for lamps.